Intel, Siemens announce manufacturing collaboration
Intel Corp. (Nasdaq: INTC) and Siemens AG plan to collaborate on semiconductor manufacturing efficiency and sustainability, the two tech giants announced Monday morning.
A joint news release said the companies had signed a memorandum of understanding “to collaborate on driving digitalization and sustainability of microelectronics manufacturing.”
The collaboration will focus on manufacturing, factory operations, cybersecurity and supporting a “resilient” global industry, the news release said.
“Semiconductors are the lifeblood of our modern economies. Few things run without chips. Therefore, we’re proud to collaborate with Intel to quickly advance semiconductor production. Siemens will bring its entire cutting-edge portfolio of IoT (internet of things) -enabled hardware and software and electrical equipment to this collaboration,” said Cedrik Neike, CEO of Digital Industries and member of the Managing Board of Siemens AG. “Our joint efforts will contribute to achieving global sustainability goals.”
The partnership will include collaboration on initiatives to optimize energy management and address the carbon footprint of manufacturing. Intel said it would explore product and supply chain modeling solutions from Siemens to find data-based insights into reducing carbon emissions.
“The world needs a more globally balanced, sustainable and resilient semiconductor supply chain to meet the increasing demand for chips,” Keyvan Esfarjani, Intel executive vice president and chief global operations officer, said in the annoucement.
“We are excited to build upon Intel’s advanced manufacturing capabilities by expanding our collaboration with Siemens to explore new areas where we can utilize Siemens’ portfolio of automation solutions to enhance efficiency and sustainability in semiconductor infrastructure, facilities and factory operations.”