Advanced Packaging Takes Chips to the Next Level
With Moore’s Law being stretched to its maximum, research and innovation are turning to advanced packaging to make electronics more powerful and enhance the capabilities of the tiny devices that drive the technology-based products consumers enjoy and that national defense systems rely on.
Arizona State University is a key partner for the semiconductor packaging industry helping develop innovations that create more dynamic packaging opportunities. The university is one of a few in the country that teaches advanced packaging to its students, creating the skilled workforce that industry will need as it continues to grow and diversify.
“ASU’s competitive advantage in advanced packaging stems from our scale, the innovativeness of our faculty and our partnerships, which extend both locally with companies like Deca Technologies, NXP and others,” says Zachary Holman, a professor in the School of Electrical, Computer and Energy Engineering at ASU. “Advanced packaging will allow the semiconductor industry to keep growing, even though shrinking transistors is no longer the path forward. Here in Arizona we have an excellent advanced packaging industry, and it’s growing.”
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